Title :
Integration of microstrip antenna on cavity-down ceramic ball grid array package
Author_Institution :
Nanyang Technol. Univ. Sch. of Electr. & Electron. Eng., Singapore, Singapore
fDate :
10/24/2002 12:00:00 AM
Abstract :
The integration of a microstrip antenna on a thin 17×17×2 mm cavity-down ceramic ball grid array package is reported. The antenna, intended for use in either single-chip or single-package wireless transceivers, has achieved an impedance bandwidth of 1.25% and gain of 4.6 dBi at 5.15 GHz.
Keywords :
antenna radiation patterns; ball grid arrays; ceramic packaging; microstrip antennas; transceivers; 4.6 dB; 5.15 GHz; antenna gain; cavity-down ceramic ball grid array package; far-field co-polarised radiation patterns; impedance bandwidth; microstrip antenna; single-chip wireless transceivers; single-package wireless transceivers;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20020937
