Title :
Lifetime prediction and design of reliability tests for high-power devices in automotive applications
Author :
Ciappa, Mauro ; Carbognani, Flavio ; Fichtner, Wolfgang
Author_Institution :
Integrated Syst. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
Abstract :
Different procedures are defined and compared to extract the statistical distribution of the thermal cycles experienced by power devices that are installed in hybrid vehicles and operated according to arbitrary mission profiles. This enables both to design efficient accelerated tests tailored on realistic data and to provide the input for lifetime prediction models. Initially, the system lifetime is predicted under the assumption of linear accumulation of the damage produced by low cycling fatigue. Also, a novel prediction model based on some fundamental equations is introduced which takes into consideration the creep experienced by compliant materials when they are submitted to thermal cycles.
Keywords :
automotive electronics; creep; integrated circuit design; integrated circuit modelling; integrated circuit reliability; multichip modules; power integrated circuits; thermal analysis; arbitrary mission profiles; automotive applications; automotive electronics; creep; design of reliability tests; high-power devices; hybrid vehicles; lifetime prediction; low cycling fatigue; statistical distribution; thermal cycles; Automotive applications; Data mining; Equations; Fatigue; Life estimation; Life testing; Power system modeling; Predictive models; Statistical distributions; Vehicles;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2003.818148