Abstract :
The charges by opponents of MIL-HDBK-217, Reliability Prediction of Electronic Equipment, that it is inaccurate, leads to costly overdesign, actually prevents higher reliability levels from being achieved, and does not address the true causes of failures are examined. The stress-margin approach, using models based on physics-of-failure analyses, which is being considered as an alternative, is described. Work on the development of a handbook for this approach is discussed. The handbook will present a methodology for assessing system reliability on the basis of environmental and operating stresses, the materials used, and the packaging selected. Physics-of-failure software will also be developed.<>
Keywords :
circuit reliability; failure analysis; Electronic Equipment; MIL-HDBK-217; Reliability Prediction; environmental stresses; operating stresses; packaging; physics-of-failure analyses; stress-margin approach; Books; Circuit faults; Equations; Failure analysis; Heat engines; Integrated circuit reliability; Laboratories; Maintenance; Physics; Reliability engineering;
