DocumentCode
866579
Title
Semiconductor network reliability assessment
Author
Adams, J. ; Workman, W.
Volume
52
Issue
12
fYear
1964
Firstpage
1624
Lastpage
1635
Abstract
The paper discusses the reliability test plan and test results on semiconductor network microelectronic devices. Included in the test plan are reliability programs, life testing, step stress testing, and environmental tests. The failure analysis-corrective action cycle is discussed at length. The failure analysis procedure is outlined with many specific examples of analysis results at various points in the analysis procedure.
Keywords
Circuit testing; Failure analysis; Integrated circuit reliability; Life testing; Microelectronics; Production; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor device testing; Stress;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1964.3457
Filename
1445387
Link To Document