DocumentCode
866591
Title
Thin-film integrated electronic reliability
Author
Ireland, J.W. ; Fresh, D.L.
Author_Institution
Bunker-Ramo Corporation, Canoga Park, Calif.
Volume
52
Issue
12
fYear
1964
Firstpage
1635
Lastpage
1638
Abstract
A reliability approach on thin-film integrated electronics is discussed in which the overall (inherent) reliability PoA of a circuit is determined as the product of the individual part reliability Pc , design reliability Pd , and fabrication reliability Pf . This article presents data collected on the individual part reliability term for vacuum deposited thin-film resistors and capacitors. Maximum failure rates (at a 60 per cent confidence level) of 0.014 per cent per 1000 hours and 0.057 per cent per 1000 hours are reported for resistors and capacitors based on 8,000,000 element hours of data. The process used in fabricating the thin-film circuits is outlined.
Keywords
Capacitance; Capacitors; Degradation; Fabrication; Integrated circuit reliability; Life testing; Performance evaluation; Resistors; Temperature; Transistors;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1964.3458
Filename
1445388
Link To Document