DocumentCode :
86667
Title :
Implementation of a Compact EMI Filter Array for 4G-LTE Applications on LTCC
Author :
Li-Ju Chen ; Ken-Huang Lin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
Volume :
5
Issue :
6
fYear :
2015
fDate :
Jun-15
Firstpage :
713
Lastpage :
722
Abstract :
In this paper, a mixed type material is described for the first time whereby a fully integrated electromagnetic interference (EMI) filter array in low-temperature co-fired ceramic technology is implemented. To miniaturize the size of the component and have high rejection and low insertion loss, a mixed powder material with a higher permittivity and a lower loss tangent is employed to design and fabricate the filter. The material system used in this paper is BaNd2Ti4O12 + Ni-Cu-Zn ferrite. The addition of Bi2O3 reduces the sintering temperature to below 900 °C. A compact EMI filter array architecture that has a wide rejection band and sufficient isolation is also introduced. For the development of wireless communications, the spectrum for global 4G-Long Term Evolution (LTE) covers different frequencies within 700-2600 MHz. In this paper, an EMI filter array that rejects unwanted frequencies from 700 to 2700 MHz, which covers all 4G-LTE bands, is presented. The EMI filter array is 1.6 mm (L)×0.8 mm (W)×0.5 mm (H), the smallest reported so far. The measured results of the developed filter are in good agreement with the simulated results by a fullwave electromagnetic simulator.
Keywords :
4G mobile communication; Long Term Evolution; ceramic packaging; electromagnetic interference; 4G-LTE applications; LTCC; compact EMI filter array; electromagnetic simulator; integrated electromagnetic interference; low temperature cofired ceramic technology; mixed powder material; sintering temperature; Arrays; Capacitors; Couplings; Electromagnetic interference; Ferrites; Inductors; Integrated circuit modeling; 4G-Long Term Evolution dielectric devices; electromagnetic interference (EMI); ferrite; filters; filters.;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2015.2411624
Filename :
7116543
Link To Document :
بازگشت