Title :
Systematic procedures for digital system realization from logic design to production
Author_Institution :
Fairchild Semiconductor, Palo Alto, Calif.
Abstract :
A simple, systematic procedure is presented for converting Integrated Circuit Packages (ICP´s) and logical designs, first to test breadboards and prototypes and later through ascending packaging compatibility to production models. Emphasis is placed on a minimum number of human decisions, rapid design turnaround time, and available techniques using minimum cost capital equipment. The basic procedure produces two-layer printed circuit boards. A simple extension allows direct conversion to a high density multi-layer system.
Keywords :
Circuit testing; Digital systems; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Logic design; Logic testing; Packaging machines; Production systems; System testing;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/PROC.1964.3469
