DocumentCode :
866724
Title :
Three-dimensional interconnect analysis using partial element equivalent circuits
Author :
Heeb, Hansruedi ; Ruehli, Albert E.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
39
Issue :
11
fYear :
1992
fDate :
11/1/1992 12:00:00 AM
Firstpage :
974
Lastpage :
982
Abstract :
Two extensions to the partial element equivalent circuit (PEEC) approach for interconnect modeling are presented. First, retardation, the effect of the finite speed of electromagnetic interactions, is included. Second, PEEC is extended to include a circuit model of finite-size homogeneous dielectrics. It is shown that the retarded PEEC formulation with the new dielectric model is equivalent to a full-wave solution of Maxwell´s equation. Since they can be combined with linear and nonlinear circuits, the resulting models are more flexible than existing full-wave solvers
Keywords :
distributed parameter networks; equivalent circuits; linear network analysis; packaging; 3D interconnect modelling; circuit model; electromagnetic interactions; finite-size homogeneous dielectrics; interconnect analysis; partial element equivalent circuits; Capacitance; Distributed parameter circuits; Equivalent circuits; Finite difference methods; Frequency domain analysis; Integrated circuit interconnections; Maxwell equations; RLC circuits; Time domain analysis; Wires;
fLanguage :
English
Journal_Title :
Circuits and Systems I: Fundamental Theory and Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
1057-7122
Type :
jour
DOI :
10.1109/81.199878
Filename :
199878
Link To Document :
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