• DocumentCode
    867755
  • Title

    Foreword Wafer-Level Packaging: Interconnects for Enhanced Reliability

  • Author

    Nguyen, L. T.

  • Volume
    32
  • Issue
    2
  • fYear
    2009
  • fDate
    5/1/2009 12:00:00 AM
  • Firstpage
    360
  • Lastpage
    361
  • Abstract
    The four articles in this special section focus on wafer-level packaging and interconnects for enhanced reliability.
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2022602
  • Filename
    4926129
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=867755