Title :
Compact 8-wavelength×2.5 Gbit/s transmitter/receiver module using PLC hybrid integration technology for WDM interconnections
Author :
Ohyama, T. ; Akahori, Y. ; Yamada, T. ; Kasahara, R. ; Kamei, S. ; Ishii, M. ; Nakamura, M. ; Oohashi, H. ; Matsuura, N. ; Yamakoshi, K.
Author_Institution :
NTT Photonics Labs., Kanagawa, Japan
fDate :
11/21/2002 12:00:00 AM
Abstract :
A compact 8-wavelength×2.5 Gbit/s hybrid integrated transmitter/receiver module has been successfully developed, in which eight DFB-LDs/PDs are flip-chip bonded on an AWG multi/demultiplexer. It has also been confirmed that these WDM modules provide satisfactory levels of performance for realising switching systems with a 5 Tbit/s throughput using WDM interconnections.
Keywords :
arrayed waveguide gratings; demultiplexing equipment; distributed feedback lasers; flip-chip devices; multiplexing equipment; optical communication equipment; photodiodes; semiconductor lasers; transceivers; wavelength division multiplexing; 2.5 Gbit/s; 5 Tbit/s; AWG multiplexer/demultiplexer; DFB-LDs/PDs; PLC hybrid integration technology; WDM interconnections; flip-chip bond; switching systems; throughput; transmitter/receiver module;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20021079
