Title :
Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Packaging
Author :
Charboneau, Bryan C. ; Wang, Fei ; Van Wyk, Jacobus Daniel ; Boroyevich, Dushan ; Liang, Zhenxian ; Scott, Elaine P. ; Tipton, C. Wesley, IV
Author_Institution :
Maryland Univ., College Park, MD
Abstract :
This paper presents a double-sided liquid cooling scheme for power MOSFETs using embedded power packaging technology. A liquid module test bed has been built to create various convection conditions and is used with 600-V high-current MOSFET-based embedded power samples to test the effectiveness and feasibility of the proposed scheme. Compared with single-sided liquid cooling, an improvement of 45% to 60% in thermal resistance is experimentally shown, for embedded power with double-sided liquid cooling for a device loss between 5 and 300 W and 0.25 to 4.5 GPM water flow rate. The trend and concept is also validated with physics-based lumped parameter thermal models.
Keywords :
cooling; power MOSFET; semiconductor device packaging; thermal management (packaging); thermal resistance; device loss; double-sided liquid cooling; embedded power packaging; physics-based lumped parameter thermal models; power 300 W; power 5 W; power MOSFETs; power semiconductor devices; thermal resistance; voltage 600 V; water flow rate; Electronic packaging thermal management; Insulated gate bipolar transistors; Liquid cooling; Power electronics; Power engineering and energy; Power semiconductor devices; Power system interconnection; Semiconductor device packaging; Semiconductor devices; Thermal resistance; Double-sided cooling; forced liquid convection; power density; semiconductor packaging;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2008.2002270
