DocumentCode :
86918
Title :
Chua´s Constitutive Memristor Relations for Physical Phenomena at Metal–Oxide Interfaces
Author :
Orlowski, Marius ; Secco, Jacopo ; Corinto, Fernando
Author_Institution :
Dept. of Electron. Eng., Virginia Tech, Blacksburg, VA, USA
Volume :
5
Issue :
2
fYear :
2015
fDate :
Jun-15
Firstpage :
143
Lastpage :
152
Abstract :
Despite a considerable number of memristor models of different complexity proposed in the literature, there is an ongoing debate over what kind of memristor model should be universally adopted for exploration of the unique opportunities integrated memristor circuits may offer. Here, we follow Chua´s approach, that models for i-v characteristics are devoid of predictive power and that instead a memristor model should be expressed in terms of electric flux φ and total charge q only-independent of any specific driving input. Accordingly, Chua´s constitutive memristor relations are constructed explicitly for Williams´ famous TiO2 device in terms of q=q(φ). It is shown that this kind of model describes correctly the prevalent physical phenomena at the metal-oxide interfaces and is able to predict without any further parameters or assumptions, the dependence of Vset and Vreset voltages on the particular input voltage wave form. The impact of thermal (memory) effects on device performance is explored in numerical simulations.
Keywords :
Chua´s circuit; circuit complexity; memristor circuits; titanium compounds; Chua constitutive memristor relations; TiO2; electric flux; i-v characteristics; input voltage waveform; integrated memristor circuits; metal-oxide interfaces; numerical simulations; physical phenomena; thermal effects; Biological system modeling; Electrodes; Heating; Integrated circuit modeling; Ions; Mathematical model; Memristors; Memristor; titanium oxide;
fLanguage :
English
Journal_Title :
Emerging and Selected Topics in Circuits and Systems, IEEE Journal on
Publisher :
ieee
ISSN :
2156-3357
Type :
jour
DOI :
10.1109/JETCAS.2015.2435513
Filename :
7116609
Link To Document :
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