• DocumentCode
    869764
  • Title

    Method for checking ohmic back contact on semiconductor wafers using 4-point-probe measurements

  • Author

    Hall, Rick

  • Author_Institution
    University of Liverpool, Department of Electrical Engineering and Electronics, Liverpool, UK
  • Volume
    2
  • Issue
    10
  • fYear
    1966
  • fDate
    10/1/1966 12:00:00 AM
  • Firstpage
    370
  • Lastpage
    371
  • Abstract
    A method is devised to check the ohmic back contact to semiconductor wafers. It is applied to determine the effectiveness of aluminium and nickel plating as a back contact on silicon ptype and ntype wafers, respectively, during the process of alloyed-junction fabrication.
  • Keywords
    semiconductors; testing;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19660310
  • Filename
    4206976
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=869764