DocumentCode :
870171
Title :
Frequency dependencies of power noise
Author :
Garben, Bernd ; Frech, Roland ; Supper, Jochen ; McAllister, Michael F.
Author_Institution :
IBM Deutschland GmbH, Boeblingen, Germany
Volume :
25
Issue :
2
fYear :
2002
fDate :
5/1/2002 12:00:00 AM
Firstpage :
166
Lastpage :
173
Abstract :
In this paper, frequency dependencies of delta-I noise caused by variations of the on-chip switching activity have been analyzed by simulations for a complex computer system board with multi-chip module, especially the impact of coincidences with resonances of the power distribution system. The switching frequency and the noise source waveform have been varied in case of a single delta-I step. For repeated delta-I steps the power noise dependencies on the repetition frequency, the duty cycle and the damping of the resonant loop have been analyzed. Simulations using switching current sources for on-chip switching have been confirmed by simulations with switching resistors plus de voltage source. Mid-frequency noise simulations using SPEED2000 and noise voltage measurements yield the same results within 6% for the first and second voltage droops and overshoots, if the real resistance of power/ground vias and module pins are included in the simulation.
Keywords :
circuit simulation; computer power supplies; finite difference time-domain analysis; integrated circuit noise; multichip modules; power supply circuits; waveform analysis; DC voltage source; FDTD method; SPEED2000; coincidences with resonances; complex computer system board; decoupling capacitor; delta-I noise; duty cycle; frequency dependencies; high-frequency oscillation; module pins; multichip module; noise simulations; noise source waveform; noise voltage measurements; on-chip switching activity; power distribution system; power supply noise; power/ground vias; repetition frequency; resonant loop damping; switching current sources; switching resistors; time domain simulations; Analytical models; Computational modeling; Computer simulation; Damping; Distributed computing; Power distribution; Resonance; Switching frequency; System-on-a-chip; Voltage;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2002.804783
Filename :
1049626
Link To Document :
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