• DocumentCode
    870203
  • Title

    Resolving degradation mechanisms in ultra-high performance N-p-n heterojunction bipolar transistors

  • Author

    Chang, Yang-Hua ; Li, G.P.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
  • Volume
    40
  • Issue
    4
  • fYear
    1993
  • fDate
    4/1/1993 12:00:00 AM
  • Firstpage
    692
  • Lastpage
    697
  • Abstract
    The conduction band barrier caused by base dopant outdiffusion is investigated for MBE-grown AlxGa1-xAs/GaAs N-p-n linearly graded heterojunction bipolar transistors (HBTs). The change of the B-E heterojunction conduction band barrier can be directly revealed by a novel technique based on the diffusion-thermionic emission current model. This is accomplished by measuring the inverted collector current ratio at two different heterojunction reverse biases. In addition, this ratio is found to correlate with an anomalous base current component measured at low temperature. The heterojunction potential barrier and the anomalous base current component are attributed to beryllium redistribution during MBE growth and forward current stress. This suggests that the diffusion and incorporation of beryllium dictate V BE uniformity and long-term reliability of HBTs
  • Keywords
    III-V semiconductors; aluminium compounds; beryllium; gallium arsenide; heterojunction bipolar transistors; molecular beam epitaxial growth; reliability; semiconductor device models; semiconductor doping; semiconductor growth; AlxGa1-xAs-GaAs:Be; B-E heterojunction conduction band barrier; VBE uniformity; anomalous base current component; base dopant outdiffusion; degradation mechanisms; diffusion-thermionic emission current model; forward current stress; heterojunction bipolar transistors; heterojunction potential barrier; heterojunction reverse biases; inverted collector current ratio; long-term reliability; semiconductors; Capacitance; Current measurement; Degradation; Doping; Gallium arsenide; Heterojunction bipolar transistors; Ohmic contacts; Photonic band gap; Temperature measurement; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.202779
  • Filename
    202779