Title :
Electrical insulation characteristics of cold dielectric high temperature superconducting cable
Author :
Suzuki, Hiroshi ; Takahashi, Toshihiro ; Okamoto, Tatsuki ; Akita, Shirabe ; Ozawa, Yasuo
Author_Institution :
Electr. Eng. Dept., Central Res. Inst. of Electr. Power Ind., Yokosuka, Japan
fDate :
12/1/2002 12:00:00 AM
Abstract :
For the optimization of electrical insulation design for high temperature superconducting (HTS) cable, evaluation of electrical insulation characteristics especially for butt gap of LN2 impregnated cold dielectric (CD) which consists of the wrapped tape insulation impregnated with LN2 plays an important role. This paper presents partial discharge (PD) inception and breakdown characteristics in LN2 impregnated butt gap model which modeled a weak point of the wrapped tape insulation impregnated with LN2 and cable model with short length with polypropylene laminated paper (PPLP®), Nomex® paper and cellulose paper. PD current pulse was found to have a steep rise time of ∼ ns and amplitude of ∼ tens μA at PD inception voltage region. Little dependency of breakdown stress on the insulating material is found. PD inception stress is almost independent of insulation thickness of 1 to 3 mm. The requirement insulation thickness for 66 kV class HTS cable is estimated to be ∼ 5 mm under PD-free condition from viewpoint of long-term reliability.
Keywords :
electric strength; high-temperature superconductors; impregnated insulation; paper; partial discharges; power cable insulation; superconducting cables; 1 to 3 mm; 5 mm; 66 kV; breakdown characteristics; breakdown stress; high-temperature superconducting cable; insulation characteristics; insulation design optimization; long-term reliability; partial discharge inception; polypropylene laminated paper; Cable insulation; Design optimization; Dielectrics and electrical insulation; Electric breakdown; High temperature superconductors; Partial discharges; Stress; Superconducting cables; Superconducting films; Voltage;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2002.1115489