DocumentCode :
870472
Title :
Electrical test strategies for a wafer-level packaging technology
Author :
Keezer, David C. ; Patel, Chirag S. ; Bakir, Muhannad S. ; Zhou, Qing ; Meindl, James D.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
26
Issue :
4
fYear :
2003
Firstpage :
267
Lastpage :
272
Abstract :
A wafer-level packaging (WLP) technology is under development that provides compliant electrical leads with a density as high as 12,000 per cm2. The leads are batch processed while the integrated circuits are still in wafer form through a series of relatively simple photolithographic steps. After electrical testing, the wafers are diced and the integrated circuits (ICs) are ready for direct assembly to an interconnect substrate. Sufficient lateral and vertical compliance is provided by the leads to accommodate the nonplanarity encountered during assembly and the thermal mismatch between the IC and substrate during normal operation. The high density of compliant leads presents both challenges and opportunities for electrical testing. This paper first summarizes the process technology used to fabricate these high-density electrical contacts. Several potential test strategies are then introduced that may take advantage of these contacts.
Keywords :
integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; integrated circuit testing; thermal management (packaging); wafer-scale integration; WLP technology; compliant electrical leads; electrical testing; integrated circuits; interconnect substrate; photolithographic steps; thermal mismatch; wafer form; wafer-level packaging; Assembly; Bonding; Circuit testing; Contacts; Costs; Fabrication; Integrated circuit packaging; Integrated circuit technology; Lead; Wafer scale integration;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2003.822063
Filename :
1262379
Link To Document :
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