DocumentCode :
870508
Title :
Off-line control of time-pressure dispensing processes for electronics packaging
Author :
Chen, X.B. ; Zhang, W.J. ; Schoenau, G. ; Surgenor, B.
Author_Institution :
Dept. of Mech. Eng., Univ. of Saskatchewan, Saskatoon, Sask., Canada
Volume :
26
Issue :
4
fYear :
2003
Firstpage :
286
Lastpage :
293
Abstract :
Fluid dispensing is one critical process in electronics packaging, in which fluid materials (such as encapsulant, adhesive) are delivered controllably onto substrates for the purpose of encapsulation. Time-pressure dispensing is recently the most widely used approach, and its control has proven to be a challenging task due to the fact that the dispensing process performance is significantly affected by the behavior of the fluid dispensed. Moreover, if the fluid exhibits time-dependent behavior, the control becomes more difficult and demanding. This paper presents a method to model the time-pressure dispensing process, taking into account the time-dependent fluid behavior. Based on the model developed, an off-line control strategy is developed for improving the process performance. Experiments on a typical commercial dispensing system were carried out to verify the effectiveness of the modeling method and the off-line control strategy.
Keywords :
electronics packaging; integrated circuit manufacture; integrated circuit packaging; electronics packaging; encapsulation; fluid dispensing; fluid materials; model updating; off-line control; time-dependent fluid behavior; time-pressure dispensing; Electronics packaging; Encapsulation; Fasteners; Flip chip; Mechanical engineering; Needles; Surge protection; Thermal stresses; Viscosity; Wires;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2003.820824
Filename :
1262382
Link To Document :
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