• DocumentCode
    870527
  • Title

    Evaluation of selected Japanese lead-free consumer electronics

  • Author

    Fukuda, Yuki ; Casey, Paul ; Pecht, Michael

  • Author_Institution
    CALCE Electron. Products & Syst. Center, Univ. of Maryland, College Park, MD, USA
  • Volume
    26
  • Issue
    4
  • fYear
    2003
  • Firstpage
    305
  • Lastpage
    312
  • Abstract
    This paper discusses the transition to lead-free electronics, with emphasis on Japanese companies. The results of reverse engineering two Japanese minidisk players with "green" labels are presented. The minidisk players analyzed were Sony\´s MZ-E909 and Matsushita\´s SJ-MJ-90-A. Both of the minidisk players had three circuit cards, which were analyzed using a variety of methods including EDS, WDS, and ICP-AES. Data resulting from these tests was included along with a discussion on its significance. Moreover, the two "green" minidisk players were compared in terms of solder compositions and lead-free implementation strategies. This study revealed that products bearing the "green" label were not necessarily lead-free, but rather conformed to one of many definitions of lead-free devices. It was also found that the Japanese approach for achieving lead-free products appears to be based on an incremental transition by application, even at the board level.
  • Keywords
    electronics industry; integrated circuit packaging; reverse engineering; soldering; EDS; ICP-AES; Japanese companies; Matsushita SJ-MJ-90-A; Sony MZ-E909; WDS; circuit cards; lead-free electronics; lead-free products; minidisk players; reverse engineering; solder compositions; Consumer electronics; Electronic waste; Electronics industry; Environmentally friendly manufacturing techniques; Europe; Industrial electronics; Information technology; Lead; Semiconductor device manufacture; Solid state circuits;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2003.820820
  • Filename
    1262384