DocumentCode :
870543
Title :
Boxes: An Engineering Methodology for Calculating Soft Error Rates in SOI Integrated Circuits
Author :
Fulkerson, David E. ; Nelson, David K. ; Carlson, Roy M.
Author_Institution :
Honeywell Aerosp. Plymouth, MN
Volume :
53
Issue :
6
fYear :
2006
Firstpage :
3329
Lastpage :
3335
Abstract :
A simple methodology is necessary to characterize the SEU behavior of large quantities of RAM cell types, latches, flip-flops, other logic cells, I/O cells, etc. Such a methodology, called "Boxes", is being used for the Honeywell S150 radiation-hard 0.15 mum partially-depleted SOI process. Using physics-based equations, this paper shows how to break up each critical transistor into several "boxes", each with its own dimensions and critical charge, for the purpose of calculating soft error rate (SER). The Boxes methodology also allows for calculation of SER due to an ion that must simultaneously strike two separated sensitive volumes in order to cause an upset. This can be the dominant upset mechanism for many types of cells such as certain hardened SRAM\´s and other cells that obtain radiation hardness via extra transistors (such as triple modular redundancy, the DICE latch, etc.). Boxes also predicts upsets that can occur when an ion strike pulls a circuit node below ground or above the positive power supply. The boxes methodology was applied to a 6 T non-hardened SRAM, a hardened SRAM, and a D-type flip-flop. The theoretical predictions correlated well with experimental vertical ion strike data
Keywords :
SRAM chips; bipolar transistors; flip-flops; monolithic integrated circuits; radiation hardening (electronics); silicon-on-insulator; CREME96; D-type flip-flop; DICE latch; Honeywell S150 radiation-hardness; I/O cells; RAM cell; SOI integrated circuits; boxes methodology; critical charge; hardened SRAM; logic cells; nonhardened SRAM; partially-depleted SOI process; positive power supply; soft error rates; triple modular redundancy; upset mechanism; Circuits; Equations; Error analysis; Flip-flops; Latches; Logic; Power supplies; Radiation hardening; Random access memory; Redundancy; CREME96; SEE; SEU; SOI; SPICE; SRAM; flip-flop; modeling;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2006.886150
Filename :
4033474
Link To Document :
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