Title :
Design and fabrication of an IC encapsulation mold adhesion force tester [Abstracts of Forthcoming Manuscripts]
Author :
Shyang-Jye Chang ; Sheng-Jye Hwang
Author_Institution :
National Cheng Kung University
Keywords :
Abstracts; Adhesives; Circuit testing; Digital integrated circuits; Electromagnetic compatibility; Encapsulation; Fabrication; Force measurement; Integrated circuit testing; Surface treatment;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2003.823165
