Title :
Nonspecific binding removal from protein microarrays using thickness shear mode resonators
Author :
Meyer, Grant D. ; Morán-Mirabal, José M. ; Branch, Darren W. ; Craighead, Harold G.
Author_Institution :
Sch. of Appl. Phys., Cornell Univ., Ithaca, NY, USA
fDate :
4/1/2006 12:00:00 AM
Abstract :
Nonspecific binding is a universal problem that reduces bioassay sensitivity and specificity. We demonstrate that ultrasonic waves, generated by 5-MHz quartz crystal resonators, accelerate nonspecifically bound protein desorption from sensing and nonsensing areas of micropatterned protein arrays, controllably and nondestructively cleaning the micropatterns. Nonsensing area fluorescent intensity values dropped by more than 85% and sensing area fluorescent intensity dropped 77% due to nonspecific binding removal at an input power of 14 W. After patterning, antibody films were many layers thick with nonspecifically bound protein, and aggregates obscured patterns. Quartz crystal resonators removed excess antibody layers and aggregates leaving highly uniform films, as evidenced by smaller spatial variations in fluorescent intensity and atomic force microscope surface roughness values. Fluorescent intensity values obtained after 14-W QCR operation were more repeatable and uniform.
Keywords :
biosensors; crystal resonators; desorption; microsensors; proteins; 14 W; 5 MHz; antibody films; antibody layers; atomic force microscope surface roughness; bioassay sensitivity; bioassay specificity; fluorescent intensity values; micropatterned protein arrays; micropatterns; nonspecific binding removal; nonspecifically bound protein; protein desorption; protein microarrays; quartz crystal resonators; thickness shear mode resonators; ultrasonic waves; Acceleration; Aggregates; Atomic force microscopy; Atomic layer deposition; Cleaning; Fluorescence; Proteins; Rough surfaces; Sensitivity and specificity; Surface roughness; Nonspecific binding; protein microarray; quartz crystal resonator; ultrasonic;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2006.870172