Title :
Partial discharge testing of solder fillets on PCBs in a partial vacuum: new experimental results [Abstracts of Forthcoming Manuscripts]
Author :
Capineri, Lorenzo ; Dainelli, Giulio ; Materassi, M. ; Dunn, B.D.
Author_Institution :
Universita di Firenze
Keywords :
Abstracts; Assembly; Electrodes; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Geometry; Lead; Partial discharges; Testing; Voltage;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2003.823164
