Title :
Processing and reliability of CSPs with underfill [Abstracts of Forthcoming Manuscripts]
Author :
Jing Liu ; Johnson, R. Wayne ; Yaeger, E. ; Konarski, Michal ; Crane, Laura
Author_Institution :
Auburn University
Keywords :
Abstracts; Assembly; Chip scale packaging; Cranes; Electric shock; Electronic packaging thermal management; Industrial electronics; Rapid thermal processing; Recycling; Testing;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2003.823163
