Title :
Surface property of passivation layer on integrated circuit chip and solder mask layer on printed circuit board [Abstracts of Forthcoming Manuscripts]
Author :
Shijian Luo ; Wong, C.P.
Author_Institution :
Micron Technology, Inc.
Keywords :
Abstracts; Cleaning; Passivation; Plasma applications; Plasma materials processing; Plasma temperature; Printed circuits; Silicon compounds; Surface contamination; Surface treatment;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2003.823169
