Abstract :
Technology evolutions in logic and memory through increased integration, combined with potential improvements in machine organization, should provide processor performance in the mid 1970´s that exceeds the second generation benchmark (IBM 7090) by a factor of 1000. Serious problems of packaging require a greater system designer sensitivity to the electrical and physical properties of materials, as well as requiring a closer tie between the technologist, system designer, and software designer. The increased processor speeds also create a balancing problem as the processor input- output gap widens, and LSI could assist in the solution of this problem. This paper discusses some of the technology- dependent parameters that could permit predicted performances to be achieved.
