DocumentCode :
873535
Title :
Using compound electrodes in electrical impedance tomography
Author :
Hua, Ping ; Woo, Eung Je ; Webster, John G. ; Tompkins, Willis J.
Author_Institution :
Siemens Gammasonics Inc., Hoffman Estates, IL, USA
Volume :
40
Issue :
1
fYear :
1993
Firstpage :
29
Lastpage :
34
Abstract :
A compound electrode composed of a large outer electrode to inject current and a small inner electrode to sense voltage was developed and used to measure voltages from a physical phantom. The measured voltages were smaller in amplitude than those from conventional electrodes, demonstrating that the compound electrode can minimize contact impedance voltage drop from the measured data. A finite-element model was used for the compound electrode and incorporated into the regularized Newton-Raphson reconstruction algorithm. A sensitivity study showed that the reconstructed resistivity distributions are less dependent on the unknown contact resistance values for a compound electrode than a conventional electrode and that the use of a compound electrode results in improved images for the reconstruction algorithm.
Keywords :
computerised tomography; electric impedance imaging; compound electrodes; current injection; electrical impedance tomography; finite-element model; large outer electrode; medical diagnostic imaging; physical phantom; reconstructed resistivity distributions; reconstruction algorithm; regularized Newton-Raphson reconstruction algorithm; small inner electrode; voltage sensing; Current measurement; Electrical resistance measurement; Electrodes; Finite element methods; Image reconstruction; Imaging phantoms; Impedance measurement; Reconstruction algorithms; Tomography; Voltage; Algorithms; Bias (Epidemiology); Electric Impedance; Electrodes; Electrolytes; Equipment Design; Evaluation Studies as Topic; Galvanic Skin Response; Image Enhancement; Models, Biological; Plethysmography, Impedance; Sensitivity and Specificity; Signal Processing, Computer-Assisted; Tomography;
fLanguage :
English
Journal_Title :
Biomedical Engineering, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9294
Type :
jour
DOI :
10.1109/10.204768
Filename :
204768
Link To Document :
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