DocumentCode :
873559
Title :
Effects of local variations in skull and scalp thickness on EEG´s and MEG´s
Author :
Cuffin, B.Neil
Author_Institution :
Frances Bitter Nat. Magnet Lab., MIT, Cambridge, MA, USA
Volume :
40
Issue :
1
fYear :
1993
Firstpage :
42
Lastpage :
48
Abstract :
The results of a computer modeling study are reported. They indicate that local variations in skull and scalp thickness have effects on electroencephalograms (EEGs) and magnetoencephalograms (MEGs) which range from a simple intuitive effect to complex effects which depend on such factors as source depth and orientation, the geometry of the variation in skull and scalp thickness, etc. These results also indicate that local variations in skull and scalp thickness cause EEG localization errors which are generally much less than 1 cm and MEG localization errors which are even smaller. These results also indicate that multichannel and single-channel MEG measurements will produce localization errors of approximately the same amplitude when there is a bump on the external surface of the head but that multichannel measurements will produce significantly smaller localization errors than single-channel measurements when a depression is present in that surface.
Keywords :
biomagnetism; brain models; digital simulation; electroencephalography; MEG; electroencephalogram; head bump; local thickness variation effects; localization errors; magnetoencephalogram; multichannel measurements; scalp thickness; single-channel measurements; skull; source depth; surface depression; Brain modeling; Conductivity; Electric variables measurement; Electroencephalography; Geometry; Magnetic heads; Performance evaluation; Scalp; Skull; Thickness measurement; Action Potentials; Bias (Epidemiology); Brain; Cephalometry; Computer Simulation; Electric Conductivity; Electroencephalography; Electromagnetic Fields; Evaluation Studies as Topic; Humans; Magnetoencephalography; Models, Anatomic; Scalp; Skinfold Thickness; Skull;
fLanguage :
English
Journal_Title :
Biomedical Engineering, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9294
Type :
jour
DOI :
10.1109/10.204770
Filename :
204770
Link To Document :
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