• DocumentCode
    873928
  • Title

    IGFET circuit performance-n-channel versus p-channel

  • Author

    Cheroff, George ; Critchlow, Dale L. ; Dennard, Robert H. ; Terman, Lewis M.

  • Volume
    4
  • Issue
    5
  • fYear
    1969
  • fDate
    10/1/1969 12:00:00 AM
  • Firstpage
    267
  • Lastpage
    271
  • Abstract
    The n-channel insulated-gate field-effect transistor offers a factor of 2 to 3.4 mobility advantage (depending on crystal orientation and substrate doping level) over p-channel devices. In addition, several advantages result from the fact that the work function difference between an aluminum gate and the silicon substrate is about -0.8 volt for a p substrate compared with about zero for an n substrate. In particular, this results in a low threshold voltage that allows the use of a substrate bias to adjust the threshold voltage over a useful design range resulting in an added flexibility in choice of thresholds and substrate doping, a reduction in the effect of source-substrate bias on device threshold, decreased junction capacitance, and larger parasitic thick-oxide thresholds for a given insulator thickness. The speed, power, and density advantages of the n-channel device are illustrated for logic and memory circuits using representative n- and p-channel device designs.
  • Keywords
    Field effect transistors; field effect transistors; Aluminum; Circuits; Doping; FETs; Insulation; Logic design; Logic devices; Parasitic capacitance; Silicon; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1969.1050014
  • Filename
    1050014