DocumentCode
873928
Title
IGFET circuit performance-n-channel versus p-channel
Author
Cheroff, George ; Critchlow, Dale L. ; Dennard, Robert H. ; Terman, Lewis M.
Volume
4
Issue
5
fYear
1969
fDate
10/1/1969 12:00:00 AM
Firstpage
267
Lastpage
271
Abstract
The n-channel insulated-gate field-effect transistor offers a factor of 2 to 3.4 mobility advantage (depending on crystal orientation and substrate doping level) over p-channel devices. In addition, several advantages result from the fact that the work function difference between an aluminum gate and the silicon substrate is about -0.8 volt for a p substrate compared with about zero for an n substrate. In particular, this results in a low threshold voltage that allows the use of a substrate bias to adjust the threshold voltage over a useful design range resulting in an added flexibility in choice of thresholds and substrate doping, a reduction in the effect of source-substrate bias on device threshold, decreased junction capacitance, and larger parasitic thick-oxide thresholds for a given insulator thickness. The speed, power, and density advantages of the n-channel device are illustrated for logic and memory circuits using representative n- and p-channel device designs.
Keywords
Field effect transistors; field effect transistors; Aluminum; Circuits; Doping; FETs; Insulation; Logic design; Logic devices; Parasitic capacitance; Silicon; Threshold voltage;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1969.1050014
Filename
1050014
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