Title :
Micromachined thin film plate acoustic resonators utilizing the lowest order symmetric lamb wave mode
Author :
Yantchev, Ventsislav ; Katardjiev, Ilia
Author_Institution :
Dept. of Solid State Electron., Uppsala Univ.
fDate :
1/1/2007 12:00:00 AM
Abstract :
Thin film integrated circuits compatible resonant structures using the lowest order symmetric Lamb wave propagating in thin aluminum nitride (AlN) film membranes have been studied. The 2-mum thick, highly c-oriented AlN piezoelectric films have been grown on silicon by pulsed, direct-current magnetron reactive sputter deposition. The films were deposited at room temperature and had typical full-width, half-maximum value of the rocking curve of about 2 degrees. Thin film plate acoustic resonators were designed and micromachined using low resolution photolithography and deep silicon etching. Plate waves, having a 12-mum wavelength, were excited by means of both interdigital (IDT) and longitudinal wave transducers using lateral field excitation (LW-LFE), and reflected by periodical aluminum-strip gratings deposited on top of the membrane. The existence of a frequency stopband and strong grating reflectivity have been theoretically predicted and experimentally observed. One-port resonator designs having varying cavity lengths and transducer topology were fabricated and characterized. A quality factor exceeding 3000 has been demonstrated at frequencies of about 885 MHz. The IDT based film plate acoustic resonators (FPAR) technology proved to be preferable when lower costs and higher Qs are pursued. The LW-LFE-based FPAR technology offers higher excitation efficiency at costs comparable to that of the thin film bulk acoustic wave resonator (FBAR) technology
Keywords :
III-V semiconductors; aluminium compounds; elemental semiconductors; etching; interdigital transducers; piezoelectric thin films; semiconductor thin films; silicon; sputter deposition; surface acoustic wave resonators; surface acoustic wave transducers; wide band gap semiconductors; 12 micron; 2 micron; 293 to 298 K; AlN; FBAR technology; FPAR technology; IDT; LW-LFE-based FPAR technology; Si; acoustic resonators; aluminum nitride film membranes; c-oriented piezoelectric films; deep silicon etching; direct-current magnetron reactive sputter deposition; grating reflectivity; longitudinal wave transducers; low resolution photolithography; lowest order symmetric lamb wave mode; micromachined thin film plate; quality factor; thin film bulk acoustic wave resonator technology; thin film integrated circuits compatible resonant structures; Acoustic transducers; Acoustic waves; Biomembranes; Frequency; Gratings; Piezoelectric films; Silicon; Sputtering; Thin film circuits; Transistors; Acoustics; Computer-Aided Design; Equipment Design; Equipment Failure Analysis; Manufactured Materials; Membranes, Artificial; Microelectrodes; Miniaturization; Transducers; Vibration;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2007.214