DocumentCode :
874444
Title :
In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing
Author :
Davis, Cleon E. ; Dickherber, Anthony J. ; Hunt, William D. ; May, Gary S.
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD
Volume :
31
Issue :
4
fYear :
2008
Firstpage :
273
Lastpage :
284
Abstract :
Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing can be a viable alternative to conventional thermal techniques. However, current limitations include a lack of reliable temperature measuring techniques. This research focuses on developing a reliable temperature measuring system using acoustic techniques to monitor low-k polymer dielectrics cured on silicon wafers in a VFM furnace. The acoustic sensor exhibits the capability to measure temperatures from 20degC to 300degC with an attainable accuracy of plusmn2 degrees.
Keywords :
acoustic transducers; curing; temperature measurement; acoustic temperature measurement; low-k polymer dielectrics; silicon wafers; thermal processing; variable-frequency microwave curing; Acoustic measurements; Curing; Current measurement; Dielectric measurements; Material properties; Monitoring; Polymers; Silicon; Temperature measurement; Temperature sensors; Acoustic temperature sensing; polymer curing; rapid curing; variable frequency microwave curing; zinc oxide deposition;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2008.2004570
Filename :
4634592
Link To Document :
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