Title :
Development of a multichip module DSP
Author :
Scannell, Robert K. ; Hagge, John K.
Author_Institution :
Rockwell Int., Anaheim, CA, USA
fDate :
4/1/1993 12:00:00 AM
Abstract :
The signal processor packaging design (SPPD) general-purpose digital signal processor (DSP) architecture is discussed. SPPD is a highly modular processor architecture that is based on off-the-shelf components and that supports a multichip module (MCM) design implementation that delivers 400 million floating-point operations per second in a 75-g package. The interconnect-substrate design, MCM package assembly, MCM testing, and tradeoffs in size, weight, and cost of the SPPD packaging are described.<>
Keywords :
digital signal processing chips; multichip modules; MCM package assembly; cost; highly modular processor architecture; interconnect-substrate design; multichip module DSP; signal processor packaging design; size; weight; Assembly; Costs; Digital signal processing; Digital signal processors; Multichip modules; Packaging; Process design; Signal design; Signal processing; Testing;
