Title :
Early package analysis: considerations and case study
Author :
LaPotin, David P. ; Mazzawy, Toufie R. ; White, Marlin L.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
4/1/1993 12:00:00 AM
Abstract :
Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs settings is included. The case study indicates that the most effective packaging solution for high-performance applications, requiring multichip modules, will likely represent a progression from cofired ceramics (MCM-C) to a thin-film and hybrid cofired ceramic (MCM-D/C) module.<>
Keywords :
multichip modules; MCM-C; MCM-D/C; analysis tool; cofired ceramics; design; hybrid cofired ceramic; multichip module; package analysis; thin-film; Ceramics; Computer aided software engineering; Electronics packaging; Manufacturing; Semiconductor device packaging; Silicon; Substrates; System analysis and design; Transistors; Wiring;
