DocumentCode
876705
Title
Early package analysis: considerations and case study
Author
LaPotin, David P. ; Mazzawy, Toufie R. ; White, Marlin L.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
26
Issue
4
fYear
1993
fDate
4/1/1993 12:00:00 AM
Firstpage
30
Lastpage
39
Abstract
Several issues associated with multichip module (MCM) system design are discussed. An early analysis tool for evaluating the tradeoffs between a design and packaging technology is presented. A case study of a possible design point suggested by combining different package elements being used in MCMs settings is included. The case study indicates that the most effective packaging solution for high-performance applications, requiring multichip modules, will likely represent a progression from cofired ceramics (MCM-C) to a thin-film and hybrid cofired ceramic (MCM-D/C) module.<>
Keywords
multichip modules; MCM-C; MCM-D/C; analysis tool; cofired ceramics; design; hybrid cofired ceramic; multichip module; package analysis; thin-film; Ceramics; Computer aided software engineering; Electronics packaging; Manufacturing; Semiconductor device packaging; Silicon; Substrates; System analysis and design; Transistors; Wiring;
fLanguage
English
Journal_Title
Computer
Publisher
ieee
ISSN
0018-9162
Type
jour
DOI
10.1109/2.206511
Filename
206511
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