Abstract :
The application of advanced electronic packaging and interconnect (EP/I) technology by US Department of Defense´s Advance Research Projects Agency are discussed. The EP/I domain includes packages, multichip modules (MCMs), connectors, printed circuit boards (PCBs), boxes, backplanes, and cages. The EP/I physical technologies, including diamond substrates, superconductors, and metal matrix packages, are discussed, and information technologies are described.<>
Keywords :
multichip modules; printed circuit manufacture; substrates; Advance Research Projects Agency; EP/I; advanced electronic packaging and interconnect; backplanes; boxes; cages; connectors; diamond substrates; electronic packaging; information technologies; metal matrix packages; multichip modules; printed circuit boards; superconductors; Backplanes; Connectors; Electronics packaging; Information technology; Integrated circuit interconnections; Multichip modules; Printed circuits; Roads; Superconductivity; Transmission line matrix methods;
