Title :
Yield-enhancement techniques in semiconductor memory
Author :
Sander, Wendell B.
Abstract :
In manufacturing semiconductor memory devices a significant number of die have only a few defects. These defective parts can be used in memory-system manufacture by designing boards with part positions that can accept defective parts. These partially good parts are then categorized to match the board location. Such systems have been built using both conventional printed-circuit boards and multichip hybrid assembly.
Keywords :
Semiconductor storage devices; semiconductor storage devices; Assembly systems; Bonding; Decoding; Integrated circuit packaging; Isolation technology; Preamplifiers; Semiconductor device manufacture; Semiconductor memory; Wiring; Yield estimation;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.1972.1050303
