Title :
Water soluble paste survey for fine pitch SMT attach
Author :
Carpenter, Burton ; Pearsall, Kitty ; Raines, Robert
Author_Institution :
IBM Corp., Austin, TX, USA
fDate :
12/1/1992 12:00:00 AM
Abstract :
Off-the-shelf water-soluble solder pastes for fine pitch (0.025-in), surface mount technology (SMT) attach applications were assessed. Twenty solder paste material vendors were surveyed. Seventeen claimed to have a water soluble paste (WSP), either on the market or in development. These pastes were evaluated with two experimental methods: manufacturing line usability testing, followed by surface insulation resistance (SIR) reliability testing. The usability matrix was designed to assess each paste´s performance in each of the key process steps: screen printing, component placement, paste reflow, and board cleaning. Rosin mildly activated (RMA) paste performance in these areas was used as a benchmark for the water soluble materials. Only three pastes met all of the desired criteria. These were, subsequently, reliability tested. An additional, very fine pitch (0.020-in), screen printing experiment was performed to determine the extensibility of the selected pastes
Keywords :
materials testing; printed circuit manufacture; soldering; surface mount technology; 0.025 to 0.02 in; FPT; SIR reliability testing; board cleaning; component placement; experimental methods; fine pitch SMT attach; fine-pitch technology; key process steps; manufacturing line usability testing; materials selection; off-the-shelf pastes; paste reflow; reflow soldering; resin mildly very fine pitch screen printing; screen printing; screen printing experiment; solder paste material vendors; surface insulation resistance; usability matrix; water-soluble solder pastes; Assembly; Insulation testing; Manufacturing; Material storage; Printing; Protocols; Qualifications; Surface resistance; Surface-mount technology; Usability;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
