Title :
Temperature Effect on Heavy-Ion-Induced Single-Event Transient Propagation in CMOS Bulk 0.18
m Inverter Chain
Author :
Truyen, D. ; Boch, J. ; Sagnes, B. ; Vaillé, J.R. ; Renaud, N. ; Leduc, E. ; Briet, M. ; Heng, C. ; Mouton, S. ; Saigné, F.
Author_Institution :
IES-UMR UM2/CNRS, Nantes
Abstract :
Heavy-ion-induced single-event transients (SET) are studied by device simulation on an ATMEL spatial component: the CMOS bulk 0.18 mum inverter. The wide temperature range of a spatial environment (from 218 to 418 K) can modify the shape of the SET. Thus, an investigation of the SET propagation through a 10-inverter logic chain is performed in the 218-418 K temperature range, and the threshold LET (LETth) required for unattenuated propagation through the inverter chain is determined. The LETth is calculated for two different locations of the heavy ion impact and for three temperature values. An increase of the sensitivity is found when the temperature is raised from 218 to 418 K.
Keywords :
CMOS integrated circuits; invertors; radiation hardening (electronics); transients; ATMEL spatial component; CMOS bulk inverter chain; TCAD; heavy ion impact; heavy-ion-induced single-event transient propagation; size 0.18 mum; technology computer-aided design; temperature 218 K to 418 K; temperature dependence; temperature effect; unattenuated propagation; CMOS logic circuits; CMOS technology; Logic devices; Poisson equations; Pulse width modulation inverters; Shape; Space vector pulse width modulation; Temperature dependence; Temperature distribution; Temperature sensors; CMOS; LET; heavy ion; single event transient (SET); technology computer-aided design (TCAD) simulation; temperature dependence;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2008.2000851