Title :
Reliability evaluation of high pin count hermetic ceramic IC packages for space applications
Author :
Barrett, John J. ; Hayes, Thomas F. ; Doyle, Rory ; Mathúna, Sean Cian Ó ; Yamada, Takashi ; Boetti, Alberto
Author_Institution :
Microelectron. Technol. Support Lab., Univ. Coll., Cork, Ireland
fDate :
12/1/1992 12:00:00 AM
Abstract :
The results to date of a reliability testing program for the European Space Agency on high-pin-count hermetic ceramic packages are presented. The objectives of the program, which commenced in 1988, are discussed. Results are presented from work on: application of scanning acoustic microscopy (SAM) to die attach and lid seal quality assessment; the use of thermal characterization test chips and a computer controlled thermal resistance measurement system to measure thermal impedances of ceramic quad flat pack (CQFP) and ceramic pin grid array (CPGA) packages; numerical prediction and practical measurement of electrical parasitics of CQFP and CPGA packages; quality and reliability testing of CQPF and CPGA packages; and quality and reliability testing of 20- and 25-mil pitch surface-mount solder assemblies of high-pin-count CQFP packages assembled on printed circuit boards
Keywords :
acoustic microscopy; aerospace instrumentation; inspection; integrated circuit testing; packaging; quality control; reliability; surface mount technology; 20 mil; 25 mil; CPGA packages; CQFP packages; European Space Agency; SAM; ceramic IC packages; ceramic pin grid array; ceramic quad flat pack; computer controlled thermal resistance measurement system; die attach; electrical parasitics; high-pin-count hermetic ceramic packages; lid seal quality assessment; numerical prediction; printed circuit boards; quality testing; reliability testing; reliability testing program; scanning acoustic microscopy; space applications; surface-mount solder assemblies; thermal characterization test chips; thermal impedances; Acoustic measurements; Acoustic testing; Ceramics; Circuit testing; Electric variables measurement; Electrical resistance measurement; Impedance measurement; Packaging; System testing; Thermal resistance;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
