Title :
Reliability assessment of high lead count TAB package
Author :
Ling, Jamin ; Teoh, Hongbee ; Sorrells, David ; Jones, Jack
Author_Institution :
Digital Equipment Corp., Hudson, MA, USA
fDate :
12/1/1992 12:00:00 AM
Abstract :
The reliability assessment of a high-lead-count tape automated bonding (TAB) package using advanced packaging technology is described. The package was developed to replace existing leaded chip carriers for high I/O and high-performance applications. The package technology uses Au bumps and Au-plated, single-metal two-layer 70-mm Cu tape with a polyimide support ring. After inner lead bonding and chip encapsulation, the chip-on-tape was epoxy attached to a ceramic base and lid. This clamshell design provided both mechanical and environmental protection to the integrated circuit device
Keywords :
environmental testing; packaging; polymer films; reliability; tape automated bonding; 70 mm; Au bumps; Au-Cu tape; advanced packaging technology; ceramic base; ceramic lid; chip encapsulation; chip-on-tape; clamshell design; environmental protection; high I/O; high lead count TAB package; high-performance applications; inner lead bonding; integrated circuit device; package technology; polyimide support ring; reliability assessment; replace existing leaded chip carriers; Assembly; Bonding; Ceramics; Encapsulation; Gold; Integrated circuit packaging; Integrated circuit technology; Polyimides; Protection; Testing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
