Title :
Optimization of process parameters for laser soldering of surface mounted devices
Author :
Nicolics, Johann ; Musiejovsky, Laszlo ; Semerad, E.
Author_Institution :
Inst. fur Werkstoffe der Eleckrotech., Tech. Univ., Vienna, Austria
fDate :
12/1/1992 12:00:00 AM
Abstract :
The authors present characteristics of laser soldering the explain their importance for industrial application. The dependence of solder joint quality on the laser beam parameter settings as well as on the properties of the solder and the materials to be joined is discussed. A simple thermal model is used to describe the influence of material properties on the temperature within the solder joint. Temperature courses recorded during soldering processes while applying different parameter settings are analyzed
Keywords :
laser beam applications; optimisation; printed circuit manufacture; soldering; surface mount technology; laser soldering; surface mounted devices; thermal model; Conducting materials; Joining materials; Laser modes; Lead; Optical materials; Optical pulses; Power lasers; Soldering; Surface emitting lasers; Temperature;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
