Title :
Are components still the major problem: a review of electronic system and device field failure returns
Author :
Pecht, Michael ; Ramappan, Vijay
Author_Institution :
CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA
fDate :
12/1/1992 12:00:00 AM
Abstract :
A collection of electronic system and device (component) failure data from various sources over the last 20 years (1972-1992) is presented. Categories of failures are illustrated by means of pie charts. Issues of data collection and confusions in the definitions of failure mechanisms, failure sites, and stages of failure occurrence (design, manufacturing, testing) are discussed. The most recent data are then evaluated, the contribution of the inherent component failures to the system failures is analyzed, and conclusions of significance to the industry are discussed
Keywords :
failure analysis; data collection issues; definitions confusions; definitions of failure mechanisms; device field failure returns; electronic system field failure returns; failure data; failure sites; inherent component failures; pie charts; review; stages of failure occurrence; system failures; Bonding; Connectors; Corrosion; Failure analysis; Fatigue; Helium; Lead; Manufacturing industries; Testing; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on