Addressing the challenges of advanced packaging and interconnection

Author

Herrel, Dennis J.

Author_Institution

Microelectron. & Computer Technology Corp., Austin, TX, USA

Volume

13

Issue

2

fYear

1993

fDate

4/1/1993 12:00:00 AM

Firstpage

10

Lastpage

18

Abstract

The author contends that packaging and interconnection technology is undergoing significant changes to meet the rapidly evolving requirements of portable electronics products. The need for high density and high performance at low cost demands sophisticated developments in technology. Future portable equipment packaging requirements can be met only through advanced concepts, including multichip modules, tape-automated bonding, and flip-chip assembly. Supporting technologies, such as adhesive assembly, thermal management, and design tools must also make attendant advances. Consortium-based cooperative research and development of technologies addresses these needs, while also developing the essential vendor infrastructure.<>

Keywords

flip-chip devices; integrated circuit technology; multichip modules; tape automated bonding; adhesive assembly; design tools; flip-chip assembly; high density; high performance; interconnection; multichip modules; packaging; portable electronics products; tape-automated bonding; thermal management; Assembly; Bonding; Costs; Electronic packaging thermal management; Electronics packaging; Multichip modules; Packaging machines; Technology management; Thermal management; Thermal management of electronics;

fLanguage

English

Journal_Title

Micro, IEEE

Publisher

ieee

ISSN

0272-1732

Type

jour

DOI

10.1109/40.207084

Filename

207084