Author_Institution :
Microelectron. & Computer Technology Corp., Austin, TX, USA
Abstract :
The author contends that packaging and interconnection technology is undergoing significant changes to meet the rapidly evolving requirements of portable electronics products. The need for high density and high performance at low cost demands sophisticated developments in technology. Future portable equipment packaging requirements can be met only through advanced concepts, including multichip modules, tape-automated bonding, and flip-chip assembly. Supporting technologies, such as adhesive assembly, thermal management, and design tools must also make attendant advances. Consortium-based cooperative research and development of technologies addresses these needs, while also developing the essential vendor infrastructure.<>
Keywords :
flip-chip devices; integrated circuit technology; multichip modules; tape automated bonding; adhesive assembly; design tools; flip-chip assembly; high density; high performance; interconnection; multichip modules; packaging; portable electronics products; tape-automated bonding; thermal management; Assembly; Bonding; Costs; Electronic packaging thermal management; Electronics packaging; Multichip modules; Packaging machines; Technology management; Thermal management; Thermal management of electronics;
