Title :
Interaction of multichip module substrates with high-density connectors
Author :
Belopolsky, Yakov
Author_Institution :
Berg Electronics, Etters, PA, USA
fDate :
4/1/1993 12:00:00 AM
Abstract :
The stresses and strains in substrate-connector systems in multichip modules (MCMs) are discussed. Simultaneous stresses were applied as structural loads in combined stress models. Modeling results show that definite relations exist between connector pitch, length, substrate thickness and material, and stresses in a connector body.<>
Keywords :
multichip modules; substrates; connector pitch; high-density connectors; multichip module substrates interaction; structural loads; substrate thickness; substrate-connector systems; Connectors; Costs; Multichip modules; Nonhomogeneous media; Silicon on insulator technology; Space technology; Temperature; Thermal expansion; Thermal force; Thermal stresses;
Journal_Title :
Micro, IEEE
