Analysis and design of temperature stabilized substrate integrated circuits

A generalized temperature-stabilized substrate integrated circuit system containing heat sources and temperature sensors which are distributed in an arbitrary way in two-dimensions over the surface of the chip is analyzed. A computer-aided technique for optimum placement of these components at the layout stage so as to achieve zero nominal temperature coefficient in the performance parameter of interest is described, and other practical design considerations, such as optimum choice of stabilized chip temperature, are considered. The application of this technique is illustrated with the design of a precision temperature stabilized voltage reference supply. Experimental results from this circuit are presented.