Title : 
Compact Tri-Band Bandpass Filter Based on 
  
  Resonators With U-Folded Coupled-Line
 
        
            Author : 
Songbai Zhang ; Lei Zhu
         
        
            Author_Institution : 
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
         
        
        
        
        
        
        
        
            Abstract : 
This letter presents a novel compact microstrip tri-band bandpass filter (BPF) based on λ/4 resonators. The first and third passbands are realized by coupling the two dual-band λ/4 stepped impedance resonators (SIRs) with synthesized frequency response. Meanwhile, the second passband in the middle is achieved by introducing the two coupled λ/4 uniform impedance resonators (UIRs). A non-uniform coupled-line with the U-folded shape on one line is then proposed to independently achieve the dissimilar external couplings as desired in the tri-passbands. In parallel, the quadruplet topology for each band is formulated by introducing an additional weak I/O cross coupling, thereby bringing one pair of transmission zeros at each side of all the triple passbands, In final, a tri-band BPF with the central frequencies of 1.8, 3.5, and 5.8 GHz, and respective fractional bandwidths of 7.0%, 5.0%, and 3.5% is designed and fabricated. The measured results show good consistence with the simulated ones.
         
        
            Keywords : 
UHF filters; UHF resonators; band-pass filters; coupled transmission lines; frequency response; microstrip filters; resonator filters; BPF; I/O cross coupling; SIR; U-folded coupled-line; U-folded shape; UIR; compact microstrip triband bandpass filter; coupled λ/4 uniform impedance resonators; dual-band λ/4 stepped impedance resonators; frequency 1.8 GHz; frequency 3.5 GHz; frequency 5.8 GHz; nonuniform coupled-line; quadruplet topology; synthesized frequency response; transmission zeros; triband BPF; Quarter-wavelength resonator; U-folded coupled line; stepped impedance resonator (SIR); tri-band bandpass filter (BPF);
         
        
        
            Journal_Title : 
Microwave and Wireless Components Letters, IEEE
         
        
        
        
        
            DOI : 
10.1109/LMWC.2013.2255868