Title :
Charge separation techniques for irradiated pseudo-MOS SOI transistors
Author :
Jun, B. ; Fleetwood, D.M. ; Schrimpf, R.D. ; Zhou, X. ; Montes, E.J. ; Cristoloveanu, S.
Author_Institution :
Vanderbilt Univ., Nashville, TN, USA
Abstract :
Pseudo-metal-oxide-semiconductor (MOS) silicon-on-insulator (SOI) transistors are used to study the total ionizing dose response of buried oxides. The concentrations of radiation-induced oxide-trap and interface-trap charge are separated using midgap and dual-transistor charge separation analysis techniques. Dual-transistor analysis is shown to be especially well suited for charge separation of pseudo-MOSFETs (Ψ-MOSFETs) because the electron conduction mode of this simple point-contact device resembles an nMOS transistor, and the hole conduction mode resembles a pMOS transistor. That this is a single device ensures that the dual-transistor assumption of equal oxide-trap charge in otherwise identical n and pMOS transistors is satisfied automatically. Both electron and hole conduction current-voltage (I-V) traces must extrapolate to a common, physically realistic midgap voltage; this is employed as a test for the self-consistency of Ψ-MOSFET data. Charge separation performed using midgap and dual-transistor analyses show good agreement for the devices employed in this paper.
Keywords :
MOSFET; X-ray effects; buried layers; interface states; radiation hardening (electronics); silicon-on-insulator; X-ray irradiations; buried oxides; charge separation techniques; dual transistor method; electron conduction current-voltage traces; hole conduction current-voltage traces; interface-trap charge; midgap method; oxide-trap charge; pseudo-MOS SOI transistors; radiation-induced charge; total ionizing dose response; Automatic testing; CMOS technology; Charge carrier processes; Helium; Insulation; MOSFETs; Performance analysis; Silicon on insulator technology; Substrates; Voltage;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2003.821380