DocumentCode :
879774
Title :
3-D simulation of heavy-ion induced charge collection in SiGe HBTs
Author :
Varadharajaperumal, Muthubalan ; Niu, Guofu ; Krithivasan, Ramkumar ; Cressler, John D. ; Reed, Robert A. ; Marshall, Paul W. ; Vizkelethy, Gyorgy ; Dodd, Paul E. ; Joseph, Alvin J.
Author_Institution :
Electr. & Comput. Eng. Dept., Auburn Univ., AL, USA
Volume :
50
Issue :
6
fYear :
2003
Firstpage :
2191
Lastpage :
2198
Abstract :
This paper presents the first 3-D simulation of heavy-ion induced charge collection in a SiGe HBT, together with microbeam testing data. The charge collected by the terminals is a strong function of the ion striking position. The sensitive area of charge collection for each terminal is identified based on analysis of the device structure and simulation results. For a normal strike between the deep trench edges, most of the electrons and holes are collected by the collector and substrate terminals, respectively. For an ion strike between the shallow trench edges surrounding the emitter, the base collects appreciable amount of charge. Emitter collects negligible amount of charge. Good agreement is achieved between the experimental and simulated data. Problems encountered with mesh generation and charge collection simulation are also discussed.
Keywords :
Ge-Si alloys; heterojunction bipolar transistors; ion beam effects; radiation hardening (electronics); semiconductor device models; 3-D simulation; SiGe; SiGe HBTs; collector terminals; deep trench edges; device structure; heavy-ion induced charge collection; ion striking position; mesh generation; microbeam testing data; simulation results; substrate terminals; Analytical models; Circuit simulation; Circuit testing; Doping; Germanium silicon alloys; Heterojunction bipolar transistors; Mesh generation; Microelectronics; Silicon germanium; Space technology;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2003.820775
Filename :
1263860
Link To Document :
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