Title :
Some reliability problems of surface-mounted devices
Author_Institution :
Tokyo Denki Univ., Japan
fDate :
7/1/1988 12:00:00 AM
Abstract :
The general characteristics of suitable SMT (surface mount technology) substrates are outlined, and various substrate materials are considered. Adhesion between devices and substrates is discussed. In particular, the effects of cycle strains and stresses, problems related to solder and contact metals, and electromigration problems are examined.<>
Keywords :
adhesion; circuit reliability; deformation; electromigration; soldering; stress effects; substrates; surface mount technology; SMT; adhesion; contact metals; cycle strains; electromigration problems; packaging; reliability; solder; stresses; substrate materials; surface-mounted devices; Assembly; Ceramics; Conducting materials; Electronic equipment; Inorganic materials; Power dissipation; Substrates; Surface-mount technology; Thermal conductivity; Thermal resistance;
Journal_Title :
Circuits and Devices Magazine, IEEE
