Title :
Fabrication method for a winding assembly with a large number of planar layers
Author :
Ngo, Khai D T ; Alley, Robert P. ; Yerman, Alexander J.
Author_Institution :
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
fDate :
1/1/1993 12:00:00 AM
Abstract :
Z-folding of flex circuits is presented as a method of fabricating a transformer winding assembly having a large number of conductive and insulating layers. Flex-circuit patterns. for practical winding configurations are described along with a synthesis procedure. The steps to assemble interleaved planar windings from flex circuits are described. Equations relating winding resistance to geometrical parameters are derived for design purpose
Keywords :
transformer windings; Z folding; design; flex circuits; geometry; interleaved planar windings; planar layers; synthesis procedure; transformer windings; winding assembly; winding resistance; Assembly; Conductors; Copper; Fabrication; Flexible electronics; Flexible printed circuits; Insulation; Integrated circuit interconnections; Laminates; Transformers;
Journal_Title :
Power Electronics, IEEE Transactions on
