DocumentCode :
881000
Title :
Radiation Hardened Silicon Devices Using a Novel Thick Oxide
Author :
Watanabe, Kikuo ; Kato, Masataka ; Okabe, Takahiro ; Nagata, Minoru
Author_Institution :
Central Research Laboratory, Hitachi, Ltd. Kokubunji, Tokyo 185, Japan
Volume :
32
Issue :
6
fYear :
1985
Firstpage :
3971
Lastpage :
3974
Abstract :
A radiation hardened thick oxide technology is proposed. It utilizes a double layer consisting of a thick chemically deposited SiO2 over a thin thermal SiO2. In npn transistors, a 1.5 order of magnitude improvement in radiation tolerance is observed when this technology is combined with a highly doped Si surface layer.
Keywords :
Bipolar transistors; Chemicals; Dielectric thin films; Electrodes; MOS capacitors; Radiation hardening; Semiconductor films; Silicon devices; Substrates; Voltage;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.1985.4334052
Filename :
4334052
Link To Document :
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